Upper Shell Introduces Advanced Intelligent Ceramic Manufacturing Solutions for Next-Gen Production

As the complexity of integrated circuits grows, manufacturers are increasingly turning to Advanced Intelligent Ceramic Manufacturing Solutions to meet stringent production requirements. These ...
Business Wire

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor ...
EDN

Ceramic-on-metal process improves thermal, electrical performance

A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Semiconductor Engineering

Addressing The ABF Substrate Shortage With In-Line Monitoring

Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
Semiconductor Engineering

Mastering FOWLP And 2.5D Design Is Easier Than You Think

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...