CMP is necessary, but this may also contribute to yield loss in applications where the process is not appropriately monitored and controlled. As more CMP steps are introduced into the process and the ...

The CMP overpolish step can be increased to remove additional M2 metal residue during the M2 CMP process, but it will also reduce the M2 height and increase the M2 resistance. As seen in figure 6, the ...

Better measurement of edge defects can enable higher yield while preventing catastrophic wafer breakage, but the number of possible defects is increasing.

CMP filtration media, such as that manufactured by Entegris, has long been used in the CMP process to maintain the desired slurry characteristics. As device geometries shrink, however, so does the ...

For post-CMP cleaning, the system boasts alternative drying technology that provides consistently low defect counts for all wafer surfaces," said Russell Ellwanger, vice president and general ...

Mark Bumiller discusses using the Accusizer for detecting large particle counts in CMP slurries to prevent wafer defects.

By reducing the downward pressure and friction on the wafer to below 1.0 psi, the system eliminates tear-outs and delamination, a major problem with dielectric films that are less mechanically robust, ...

Utilizing IR PiFM, researchers can accurately analyze contaminants and defects under 20 nm, enhancing surface characterization in semiconductor applications.

The global CMP consumables market volumes continue to grow faster than semiconductor volumes as additional CMP process steps are added in each device generation.

Semiconductor technology leader and CMP help universities, research labs and companies prototype next generation of Systems on Chip Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP ...