The most familiar bags of treats in the grocery store snack aisle may get an updated look thanks to students at Rochester Institute of Technology. A team of graduate and undergraduate students ...

Projects will include re-envisioning known brands as well as creating new brand and packaging designs, utilizing the tactics covered in class. Finished projects can be used as job-ready portfolio ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.