Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

The most important parameter to judge a CPU system is its performance. You want the processor to be fast enough to fulfil your requirements. A good way to select a CPU is to shortlist a few options ...

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

In an era where semiconductor technology drives innovation across industries, the importance of effective verification methods has never been more prominent. As designs become increasingly complex, ...

Verify Device Functionality: Confirm logic, analog, RF, or memory blocks operate per specification. Characterize Parametric Performance: Measure leakage currents, threshold voltages, timing margins, ...

SUNNYVALE, Calif., Sept. 3, 2025 — Today Synopsys (Nasdaq: SNPS) announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, ...