Using its 100G PAM4 multimode VCSEL and PD platform, Coherent has introduced a high-density 2D array architecture (1.6T, 850 ...
The collaboration combines Sivers’ customised high-power distributed feedback (DFB) laser technology with POET’s Optical ...
Mitsubishi Electric has completed its new SiC power semiconductor facility in Kikuchi, Kumamoto Prefecture. The facility will start operations in November 2025.
Chinese firms Novosense Microelectronics, UAS, and Innoscience have signed a strategic cooperation agreement to jointly ...
In conventional molecular semiconductor solar cells, the conversion of an absorbed photon into electrons and holes ...
Samco has sold its advanced etching system, the RIE-400iP-ALE, to the University of Adelaide, marking the first introduction ...
Wolfspeed has announced the successful completion of its financial restructuring process and emergence from Chapter 11 ...
The tuneable laser PIC integrates gain, SOA, filter, and wavemeter functions into a compact single device. Samples already ...
Atoms in crystalline solids sometimes vibrate in unison, giving rise to phonons. Because these collective vibrations set the ...
Infineon has expanded its CoolSiC MOSFETs 400V G2 portfolio with the top-side-cooled (TSC) TOLT package as well as the TO-247 ...
Engineers from the University of Buffalo are claiming to have realised the first successful trap passivation of b-Ga 2 O 3 RF ...
Taiwan's Industrial Technology Research Institute (ITRI) and the UK's National Physical Laboratory (NPL) have signed a cooperation agreement for semiconductor measurement standards.
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