Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI ...

Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027.

The Centra Smart Hub, combined with Advanced Energy’s new Remote Smart Sensors (RSS), enables more accurate wafer-temperature measurement and real-time temperature control for many lamp-heated Si and ...

Applied Materials, Inc. today unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center, a $5 billion capital investment* to build the world’s largest facility dedicated to ...

The CEO Summit at SEMICON West is a premier leadership forum focused on the technologies, investments, and strategic priorities shaping the future of the semiconductor industry. Aligned with the ...

New connectivity, storage and acceleration solutions help address performance, security and scalability challenges across modern computing architectures.

New series of testers extend the UltraFLEXplus architecture to deliver superior floor space economics for high-mix, variable-volume manufacturing.

SUSS MicroTec SE, a supplier of equipment and process solutions for the semiconductor industry, today announces its entry into the wafer-level cleaning market with the launch of the new GreenTec ...

White Knight Fluid Handling, a provider of high-purity fluid handling equipment and a Graco company, today announced the launch of its ThermaPoint Compact Inline Heaters.

ERS electronic today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates.

As part of its first phase, Rapidus announced the formation of Design Solution Associates to help customers support early-stage design for Rapidus’ advanced 2nm semiconductor foundry.

The new 27 kW three-phase PSU will be showcased at Infineon’s booth E26 at the OCP Global Summit 2026 in San Jose, California, from October 12 to 15 and at Infineon’s OktoberTech™ Silicon Valley 2026 ...