The novel epoxy resin formation, targeting composites fabrication, improves finish clarity, enhances toughness and is cold ...
Reformulated adhesives, available in Europe, are free from BPA and CMR-classified substances. PCR plastic cartridges will ...
Abstract: Wire bond is the most common inter-connection method used to connect microchips to the terminals of a chip package. Wire bond reliability is vital to the performance of packaging device. The ...
Development of Direct Cooling Stator Structure Using High Thermal Conductive Epoxy Molding Compounds
Abstract: This paper presents an effort to realize a stator with a direct cooling coil structure as a solution for a drive motor in the trend to promote electrification of automobiles. A channel made ...
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