The NAND modules are soldered onto a PCB, and the memory controller is on the SoC. Better yet, older designs had the entire ...

The DRAM industry has long been plagued by the security risk of RowHammering, and mitigation techniques have done little to ...

The new QLC UFS Ver. 4.0 device integrates the company’s innovative BiCS FLASH 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and ...

SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute Express Link (CXL) ...

The new AMD Ryzen 7 9800X3D pairs Zen 5 with 2nd Generation 3D V-Cache to boost gaming perfomance, increase clocks, and ...

So much has changed since then but one thing still remains true: the PC is the platform to enjoy gaming at its very best.

Additionally, the company launched a new high-bandwidth memory controller (HBM4) for AI and graphics-heavy applications, ...

Renesas has expanded its Arm Cortex-M85-based RA8 series to include two new entry-level MCUs, RA8E1 and RA8E2. The new ...

Lenovo aims to unlock peak performance with the Yoga Slim 7i Aura Edition, enhancing it with AI to be quicker, more secure, ...

Under Armour sale: deals from $10 @ Amazon Under Armour's early Black Friday sales have already arrived! Whether you're ...

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...