President Trump's agreement with Japan unlocks up to $21 billion investment to expand foundational semiconductor production, ...

Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack ...

When SEMI asks member companies what could hold back their growth, the number one answer is talent, Joe Stockunas, president of SEMI Americas, said at Monday’s SEMICON West press conference.

Advanced packaging has a bigger place at SEMICON West than ever, with three days of packaging content on this year’s program, and SEMI is building a global home for the topic through its Advanced ...

ChipAgents, the agentic AI platform for semiconductor engineering, today introduced Build-A-Chip-Bench, a benchmark built in collaboration with NVIDIA designed to test whether AI agents can carry an ...

Siemens today announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.

Nexus and Oscar are Eliyan’s first NuLight chiplet products that enable optical connectivity designed for the high-bandwidth, extended reach, and low-power requirements of large AI scale-up and future ...

NVIDIA today announced semiconductor leaders are adopting NVIDIA CUDA-X libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms ...

Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI ...

Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027.

Ahead of his presentation at SEMICON West, Chris Jones, Environmental Sustainability Manager at Edwards, argues that framing misses most of what actually drives a fab’s environmental performance.

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced Kulicke & Soffa as the recipient of the 2026 SEMI Award for ...