Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...

A new technical paper titled “Silent Data Corruption by 10x Test Escapes Threatens Reliable Computing” was published by ...

Accuracy Trade-Offs in Massive MIMO Signal Detection Using SRAM-Based In-Memory Computing” was published by researchers at ...

Mobile game developers around the world face increasing pressure to meet user expectations for sharper visuals, smoother gameplay, and longer battery life. Balancing these goals on constrained mobile ...

This article examines the system-level challenges in enabling seamless 1.6 Tbps port-level interoperability for ...