Design And Reuse

BEVFormer-Tiny on Chimera: Bird's-Eye-View Perception in One GPNPU Kernel

BEVFormer-Tiny runs its neural-network stages in one Chimera GPNPU kernel. Six camera inputs, 16.1 million cycles per frame ...
Design And Reuse

Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins

MosChip brings expertise Silicon design expertise spanning RTL design and verification, synthesis, DFT, physical design, and ...
Design And Reuse

Scaling Sandboxed Agentic AI on Xeon CPUs

Several sandboxing approaches are commonly used today, including virtual machines, containers, microVMs, and the open-source ...
Design And Reuse

T2M-IP Brings Greater Design Freedom to Semiconductor IP with WhiteBox Licensing

22nd Sep 2026. – T2M-IP, a global independent semiconductor technology expert, is strengthening its WhiteBox IP licensing portfolio, providing semiconductor companies with greater freedom to customize ...
Design And Reuse

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench ...
Design And Reuse

Samsung Foundry to Manufacture Anthropic AI ASIC on 2 nm Node

Samsung Foundry may be on the verge of securing a significant deal with AI lab Anthropic to manufacture AI accelerators. According to the latest report, Anthropic is developing its custom AI ...
Design And Reuse

Articron Challenges 1 Trillion KRW Valuation via Next-Gen Memory IP

Articron aims to scale its corporate valuation to over 1 trillion KRW by 2030 through next-generation artificial intelligence (AI) memory semiconductor intellectual property (IP). "Our target is to ...
Design And Reuse

Lattice Semiconductor partners with Arm on AI server security

HILLSBORO, Ore. - Lattice Semiconductor (NASDAQ:LSCC) announced a collaboration with Arm to develop secure control and management solutions for AI infrastructure, according to a press release ...
Design And Reuse

GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI

SPRINT expansion on track to increase Dresden capacity to more than one million 300mm wafers annually by the end of 2028, FDX Fusion will bring next-generation, energy-efficient technology for ...
Design And Reuse

Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt

The evolution of edge systems is shifting the focus from computing power alone to how efficiently each watt is transformed into useful performance. Chiplets and modular system-on-chips (SoCs) enable ...
Design And Reuse

AMD CEO Visits Samsung for HBM, Samsung Wants Foundry Orders in Return

AMD CEO Dr. Lisa Su reportedly visited Samsung on October 7th and spent about three hours with Samsung chip chief Jun Young-hyun in Seoul on Wednesday, and a Korean media report suggests the two sides ...
Design And Reuse

TSMC September 2026 Revenue Report

TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for September 2026: On a consolidated basis, revenue for September 2026 was approximately NT$511.86 billion, a decrease of 0.6 percent from ...